Nistec Newsletter #26 – Automating Through-Hole Assembly

The newsletter introduces the Through-Hole (TH) technology for electronic components, where pins extend through holes in a printed circuit board (PCB) and are soldered for secure electrical connections. Traditionally, TH components were soldered manually or with specialized machinery. However, Nistec now uses an automated assembly line, providing several advantages, including faster production—up to 10 times faster than manual methods—and greater precision.

The automated assembly also results in lower costs, as it utilizes Surface Mount Technology (SMT) lines, making it more efficient and affordable than traditional methods. This advancement ensures high-quality soldering and significantly reduces production times, offering a more streamlined process for complex PCB manufacturing.