Nistec PCB Embedded Components Technology

Nistec has executed a PCB using “embedded components” technology

Nistec has announced that it recently executed designing and production of a PCB using “embedded components” technology. The circuit was planned at its assembly company, Nistec Design, for a security company, in dimensions of 5 x 5 mm and contained laser diodes and a miniature glass cell. The company implemented the embedded resistor in internal layers of the printed circuit of dimensions 0.15 x 0.47 mm. The objective of the embedded resistor was to heat the circuit to an operating temperature of the laser diodes. The location of the standard resistor component over the area of the circuit did not achieve the desired temperature and the dispersal of uniform heat over the area of the diode. On the other hand, implementation of the embedded resistor in the circuit, succeeded in achieving a resistance of 50 ohm of a uniform shape over the area of the diode and thereby bringing it up to the ideal operational temperature. This process entails within several significant advantages such as: minimization and reduction of weight – by reducing the area of the components in the circuit; decrease of costs of the product – by means of reducing the quantity of components; improved functional performances – in the light of a shorter connection between the components thereby reducing the impedance and the noise of the electronic signals; high reliability and quality – by reducing the risk of a component failure as it is not assembled on the area of the circuit but rather it is embedded inside the PCB and also thermal efficacy and stability. “This is a real pronouncement by means of which it shall be possible to streamline and improve existing electronic circuits and at the very least it opens a new opening for development of new products that shall be able to make use of this technology, to realize their ideas” states Arbel Nissan, CEO of Nistec Design, “the important combination between planning and production, enables supply of added technological value for development engineers”.